Tech Next

Archive for January, 2010

Michael Kozicki, an  electrical engineering professor and the researchers have found that we can make stackable memory using “ionic memory technology,” which  makes them high-density memory storage cells. The new method also uses common electronics materials.
The high-density data storage by ‘stacking’ memory layers on top one another inside a single chip is inexpensive. The hard drive data storage capacity can be on a chip, which makes portable systems compact, more rugged and able to go longer between battery charges.
This is a significant improvement on the technology will replace Flash, using materials common to the semiconductor industry (copper-doped silicon dioxide). Now common materia – silicon  is added to the memory.
Kozicki announced the new memory device in a technical presentation he gave in November at the 2009 International Electron Devices and Materials Symposia in Taiwan.
This current technology,stacking memory cells are fast reaching the physical limits of device memory. So new types of memory that can store more information into less and less physical space.
The concept of stackable memory is like storing boxes in a small room. You can store more boxes (each a memory cell), taking advantage of 3 dimensions of the room, if you stack them, rather than only putting each box on the floor.